The essential service for the stability

 

 

HIPA-DV-P HIGH PERFORMANCE MICRO VIA DRILLING SYSTEM

The HiPA-DV-P Laser Drilling system is a high volume production workstation for Flex PCBs.

The machine combines ground-breaking HiPA laser control technology with high performance beam positioning, assuring accurate and high throughput drilling.

Diameter accuracy, roundness and Aspect Ratio of the DV-P are the highest in the market.

It is equipped with a UV laser.

 

HiPA's UV laser systems provide high process quality in many dielectrics.

Due to their high precision, they are the best solution for microvia drilling.

The HiPA-DV-P is a multi-purpose machine that can be used for BHV and THV drilling, coverlay routing and more.

The HiPA-DV-P provides manufaturers a verastile tool that can drill cleanly cut vias with excellent shape-stability at a high speed.

The system easily switches between high intensity and low intensity process steps, providing optimal performance in blind hole and through hole drilling.

HiPA’s laser control technology assures that all processes can be performed with 1 laser, making the system extremely cost efficient.

 

KEY PRODUCT FEATURES

  • Versatile machine setup for various via types and materials
  • Proprietary HiPA laser control software and optics technology
  • Repositioning accuracy ±1 µm
  • 20W or 45W UV nanosecond laser
  • Max product size 540 x 640 mm
  • User friendly Windows based user interface
  • Manual/ Reel-to-Sheet/ Reel-to-Reel available

 

ADVANTAGES

  • High processing flexibility and control
  • Superior drilling quality
  • High performance beam positioning providing processing speed & accuracy
  • Laser power monitoring system to ensure the drilling stability
  • Small via sizes: ≥25μm
  • Machining Accuracy up to ± 20 μm
  • upgrade to 45 UV laser reduces cycle time by 30%

 

KEY MACHINE SPECS

Description FPC Laser Drilling Machine
Control System HiPA laser drill software 1.0
Laser 20W/45W UV laser
Stage X/Y/Z
Maximum Operation Area 540 x 640 mm
Via Size  ≥ 25 μm
Machining Accuracy ± 20 μm
Vision System Matrix image library
Load & unload Modes Manual/ Reel-to-Sheet/ Reel-to-Reel

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