The HiPA-DV Laser Drilling system is a high volume production workstation for PCB, Rigid-Flex or Flex-PC panels.
The machine combines ground-breaking HiPA laser control technology with high performance beam positioning, assuring accurate and high throughput drilling and routing of complex features.
Our current DV portfolio is equipped with a UV laser, which is specifically suitable for drilling of flex PCBs.
HIPA-DV-P HIGH PERFORMANCE MICRO VIA DRILLING SYSTEM
The HiPA-DV-P Laser Drilling system is a high volume production workstation for Flex PCBs.
The machine combines...
HIPA-DV-S ENTRY LEVEL MICRO VIA DRILLING SYSTEM
The HiPA-DV-S Laser Drilling system is a high volume production workstation for Flex PCB drilling of THV (through holes).
The...
