HiPA's laser depanelers support manufacturers with the ongoing miniaturization of electronic components and circuit boards, offering market leading accuracy and reliability.
The HiPA-DP prevents mechanical and thermal stress by applying HiPA's cutting edge laser control technology and Scanvision™ system.
HiPA-DV: laser depaneling with optimal accuracy.
The HiPA-DP-S is our entry level model, while the HiPA-DP-M provides optimum performance.
HIPA-DP-M HIGH PERFORMANCE PCB LASER DEPANELING SYSTEM
HiPA-DP-M: high performance laser depanelers for Ultimate Accuracy & Reliability.
Laser depaneling system for...
HIPA-DP-S ENTRY LEVEL PCB LASER DEPANELING SYSTEM
HiPA-DP-S - entry-level Laser Depanelers for high Accuracy & Reliability.
Laser depaneling system for automatic PCB...
