HiPA-SS

HIPA-SS SCRIBING SYSTEM

The ideal solution for high-speed and accurate laser scribing of ceramic substrates.

Applied in chip resistor production and other product categories that require micro-processed substrates.

Extreme optical quality to achieve ultra-fine scribing: up to ±0.75μm / 70mm straightness and ±1μm positioning accuracy
0.1μm scale resolution for precise positioning
Special construction of up and down control cameras to improve positioning accuracy

DESCRIPTION

A laser scriber provides scribing of various ceramic substrates of chip resistors; infrared as well as UV models.

The laser scriber emits an extremely fine laser beam at exactly the right energy density.

The laser beam goes through an optical beam shaping process and is then expanded, filtered and focused before hitting the ceramic substrate.

The part of the substrate that is hit by the beam vaporizes, forming scribe lines on the surface.

PRODUCT HIGHLIGHTS

• Extreme optical quality to achieve ultra-fine scribing: up to ±0.75μm / 70mm straightness and ±1μm positioning accuracy

• Designed with 0.1μm scale resolution for precise positioning. • Special buffer design for high speed operation.

• Efficient Windows 10 based JS Scriber ™ control software: easy to use, precise and efficient.

• Product drawing file import function and online editing function of drawing file.

• Proprietary mechanical system for optimal stability at high speed and scribing accuracy

• Solid machine design with minimal vibration caused by XY linear module acceleration

• Special construction of up and down control cameras to improve positioning accuracy

TECHNICAL HIGHLIGHTS

Substrate Size 60 mm x 70 mm or 50 mm x 60 mm

Repeat Positioning Accuracy ±1 μm

Precision ±3 μm

Magazine Capacity 120 mm

Total Substrates/Magazine 120 (Based on 1 mm thickness)

Maximum Line Depth 15~500 μm adjustable

Minimum Line Width 15 μm