HIPA-DV-S ENTRY LEVEL MICRO VIA DRILLING SYSTEM
The HiPA-DV-S Laser Drilling system is a high volume production workstation for Flex PCB drilling of THV (through holes).
The machine combines ground-breaking HiPA laser control technology with high performance beam positioning, assuring accurate and high throughput drilling. It is equipped with a 20W UV laser.
For vias of 100 µm and smaller, laser drilling is the most common technology.
HiPA's UV laser systems provide high process quality in many dielectrics.
Due to their high precision, they are the best solution for microvia drilling.
The HiPA-DV-S is especially developed for making Through Hole Vias in Flex PCBs.
In a manufacturing situation in which only THV drilling is required, the HiPA-DV-S provides the most efficient system for an attractive price.
KEY PRODUCT FEATURES
- Specialised specs for THV drilling in Flex PCBs
- Proprietary HiPA laser control software and optics technology
- Repositioning accuracy ±1 µm
- 20W UV laser
- Manual/ Reel-to-Sheet/ Reel-to-Reel available
- User friendly Windows based user interface
- PCB flexible vacuum product jig adjustable for different board sizes
ADVANTAGES
- Superior drilling quality with high roundness and AR values
- High performance beam positioning providing processing speed & accuracy
- Laser power monitoring system to ensure the drilling stability
- High repositioning accuracy of ±1 µm
- Machining Accuracy up to ± 20 μm
- High resolution and accurate Z stage with auto-focus function
KEY MACHINE SPECS
| Description | FPC Laser Drilling Machine |
| Control System | HiPA laser drill software 1.0 |
| Laser | 20W UV laser |
| Stage | X/Y/Z |
| Maximum Operation Area | 540*640 mm |
| Via Size | ≥ 25 μm |
| Machining Accuracy | ± 20 μm |
| Vision System | Matrix image library |
| Load & unload Modes | Manual/ Reel-to-Sheet/ Reel-to-Reel |
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