HIPA-DP-S ENTRY LEVEL PCB LASER DEPANELING SYSTEM
HiPA-DP-S - entry-level Laser Depanelers for high Accuracy & Reliability.
Laser depaneling system for automatic PCB and FPC cutting.
Coaxial vision and market leading laser control software are combined to offer you cutting accuracy of up to +/- 40 µm.
Process automation for with accurate repeatability to support in-line mass production or reduce human error in a stand-alone production setting.
- Cutting accuracy up to +/- 15 µm
- ultra-high accuracy
- proprietary ScanVision technology
HIPA-DP-S Laser Depaneling Product Highlights:
- Excellent cutting quality and high reliability
- In-line and stand alone versions available
- High accuracy and repeatability through combination of Coaxial Vision alignment and auto-Z adjustment
- Thermal and mechanical stress-free process
- Low utility and maintenance costs
- Different lasers available - suitable for any type of material
- Windows based user friendly user interface
- AutoCAD importable
HIPA-DP-S Laser Depaneling machine specs:
- Max material size: 350 x 350 mm
- Different lasers for varying requirements: (UV) 20 W – (green) 40 W
- High accuracy with Coaxial Vision alignment
- Cutting accuracy: +/- 40 µm
- 2D code reading and marking capability
- Fume extractor
- Power Meter for laser power control feedback
Key Benefits of the Service
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Allround certified and insured landscapers
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