HIPA-DP-M HIGH PERFORMANCE PCB LASER DEPANELING SYSTEM
HiPA-DP-M: high performance laser depanelers for Ultimate Accuracy & Reliability.
Laser depaneling system for PCB and FPC with ultra-high precision and with real-time vision control.
The machine achieves the highest industry requirements in miniaturization of electronic components and circuit boards.
Scanvision™ and market leading laser control software provide high cutting accuracy of up to +/- 15 µm, at maximum processing speed.
HIPA-DP-M Laser Depaneling Product Highlights:
- Excellent cutting quality and high reliability
- In-line and stand alone versions available
- Proprietary technology Scanvision™ providing highest available high accuracy and repeatability
- Thermal and mechanical stress-free process
- large maximum product size
- Different lasers available - suitable for any type of material
- Windows based user friendly user interface
- AutoCAD importable
HIPA-DP-M Laser Depaneling machine specs:
- Max material size: 460 x 460 mm
- Different lasers for varying requirements: (UV) 20 W – (green) 40 W
- Enhanced accuracy with Scanvision™ multifunctional vision system
- Cutting accuracy options: +/- 40 µm or +/- 15 µm
- 2D code reading and marking capability
- Fume extractor
- Power Meter for laser power control feedback
Contact Us for More Information
Get in touch and get started with our HiPA laser solutions!